Products

DB1001EP Strip to Strip Die Bonder

New Generation Die Bonder

Automation Technology Center ’s new generation Die Bonder is first in industry to incorporate Ethercat Technology. With real-time force and axis health checking, DB1001EP delivers high accuracy placement at top productivity, ensuring good quality product delivered to end customers. Consuming power of 3A at 200Volt, DB1001EP provides best possible Cost of Ownership.

DB1200EP Reel to Reel Die Bonder

Low Cost High Quality

Low Cost High Quality Die Bonder using high precision ballscrews with easy maintenance, Ethercat Pick and Place force and Flow sensor timing chart.